Medical Design and Manufacture
We work with OEM’s worldwide to create custom solutions
for your medical device needs. A progressive USA Contract
Manufacturer with over 64 years of proven success and one
of the most trusted names in the industry.
t Medical cables, connectors and components
t;Injection molding t;High-end audio cables
t;Medical pouch sealing t;ISO 7 & 8 Cleanrooms
t In-house R&D/design/engineering/prototyping
You dream it.
uct characteristics. For
example, if many of the
vias are masked, it can be
more difficult to get good
test coverage. Medical
products often have less
vias to minimize signal interference. The schematic
is reviewed to determine
if boundary scan is an
option. Accessibility for
flying probe testing is also
The best test option
may be boundary scan, if
it is designed in and the
design is compliant with
the IEEE 1149.1 or .x connection standard.
The boundary scan test technology present
in the PCBA is to increase test coverage of
the components’ early manufacturing defects
(shorts/opens); complex PCBAs with masked
vias tend to have limited test access points.
Softshell tests, electrical test for connectivity,
functional test, x-ray laminography, and AOI
can also be used either standalone or in com-
bination depending on product requirements.
In-circuit testing is very dependent on test ac-
cessibility. If the layout is heavily masked with
low test coverage, ICT can be very high cost.
Ensuring good quality as medical products
shrink ties back to the structural integrity of the
interconnections. The critical elements to focus on
are ensuring correct spacing in the layout, printing
the correct amount of solder, and validating quality via a good automated inspection process.
AOI and x-ray laminography can be used standalone or in combination to
inspect complex PCBAs with limited test coverage.
products. Low profile components and QFNs
cannot be easily cleaned underneath the
component package. No clean chemistry is
recommended. If the product requires
conformal coating or a higher level of solder
joints cleanliness, an aqueous cleaner using
Kyzen chemistry can be used. If no clean
chemistry is used, any flux residue left behind
under the low profile components will be no
clean and benign.
The first inspection point is normally solder
paste inspection. The stencils are designed to
have a good release and machines are equipped
with automatic wipers that clean after every
print. As a result, solder paste deposit area and
height is normally consistent throughout the
production run. However, PCBAs are visually
inspected and sample solder paste height measurements are performed as part of standard
Ionic testing may be used on a sampling
basis to ensure board cleanliness requirements
are met. Test strategy varies based on prod-
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